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All RK35 Series RK33 Series RK32 Series RK31 Series RK30 Series RK18 Series RK MCU Series RK Power Series RV11 Series Rockchip Module RK8 Series RK6 Series

RK2206

典型应用方向

主要特性

Cortex-M4F Up To 200MHz
Tensilica HiFi3 DSP Up To 300MHz
Built-in 448K Byte SRAM & DTCM
Embedded 8M/4M Byte FLASH & PSRAM
WLAN 802.11 b/g/n

SPECIFICATIONS
CPU	• Cortex-M4F Up To 200MHz
DSP	• Tensilica HiFi3 DSP Up To 300MHz
Memory	• Built-in 256KB SRAM，192KB DTCM
	• Built-in 8/4 MB Flash
	• Built-in 8/4 MB PSRAM
	• Support EMMC,SD/MMC Card
Audio ADC	• 3CH Audio-ADC,1CH Audio-DAC (With-in RK812)
Audio ADC	• Class D Audio PA(With-in RK812)
Connectivity	• Built-in Power Management(With-in RK812)
	• DVP Sensor Interface
	• USB2.0 OTG, SPI, UART，I2C，PDM, I2S
Display	• MCU/SPI LCD Interface
Audio	• Multi-format audio encoder & decoder
OS	• Free RTOS

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